By John H. Lau ... [et al.]
Creation to MEMS --
Advanced MEMS packaging --
Enabling applied sciences for complex MEMS packaging --
Advanced MEMS wafer-level packaging --
Optical MEMS packaging : communications --
Optical MEMS packaging : bubble change --
Optical MEMS : microbolometer packaging --
Bio-MEMS packaging --
Biosensor packaging --
Accelerometer packaging --
Radiofrequency MEMS switches --
RF MEMS tunable capacitors and tubable band-pass filters --
Advanced packaging of RF MEMS units
Read Online or Download Advanced MEMS packaging PDF
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Additional info for Advanced MEMS packaging
Chinthakindi, Anil K. (Poughkeepsie, NY), Groves, Robert A. (Highland, NY), Stein, Kenneth J. (Sandy Hook, CT), Subbanna, Seshadri (Brewster, NY), Volant, Richard P. (New Fairfield, CT), “Micro-electromechanical varactor with enhanced tuning range,” December 9, 2003. 19 20 Chapter One 6,643,065 6,639,313 6,635,509 6,627,814 6,624,003 6,580,858 6,535,685 6,516,131 6,516,104 6,481,570 6,455,878 6,400,009 6,379,988 Silberman, Donn Michael (Aliso Viejo, CA), “Variable spacing diffraction grating,” November 4, 2003.
A packaging method for MEMS devices, and MEMS packages produced using the method,” Wang, Zhe (SG), WO2006085825 (A1)—2006-08-17. 144. “Monolithically integrated switchable circuits with MEMS,” Yang, Jeffrey M. (US), Nishimoto, Matt (US) (+3), WO2006083432 (A1)—2006-08-10. 145. “Method and system for packaging MEMS devices with incorporated getter,” Cummings, Manish, Gall, William J. (US), CN1773358 (A)—2006-05-17. 146. , Sampsell, Jeffrey (US), CN1755473 (A)—2006-04-05. 147. “Apparatus and method for wafer level packaging,” Chen, Jen-Yi (TW), Chiou, Jing-Hung (TW) (+1), TW236111 (B)— 2005-07-11.
Northville, MI), “On-wafer packaging for RFMEMS,” February 24, 2004. Chinthakindi, Anil K. (Fishkill, NY), Groves, Robert A. (Highland, NY), Stein, Kenneth J. (Sandy Hook, CT), Subbanna, Seshadri (Brewster, NY), Volant, Richard P. (New Fairfield, CT), “Microelectromechanical varactor with enhanced tuning range,” February 24, 2004. Chinthakindi, Anil K. (Poughkeepsie, NY), Groves, Robert A. (Highland, NY), Stein, Kenneth J. (Sandy Hook, CT), Subbanna, Seshadri (Brewster, NY), Volant, Richard P.
Advanced MEMS packaging by John H. Lau ... [et al.]